Liphihlelo tse ruileng haholo tsa tsamaiso ea merero le mohlala o le mong ho motho oa tšehetso li etsa bohlokoa bo holimo ba puisano ea likhoebo tse nyane le kutloisiso ea rona e bonolo ea litebello tsa hau bakeng sa theko e tlase Lms Soft Silicone High Die Cut Customized Thermal Conductivity Pad, Boleng bo phahameng, lits'ebeletso tse nakong le Aggressive. theko ea thekiso, bohle ba re fumanela botumo bo holimo tšimong ea xxx leha ho na le tlholisano e matla ea machabeng.
Liphihlelo tse ruileng haholo tsa tsamaiso ea merero le mohlala o le mong ho motho ea tšehetsang li etsa bohlokoa bo holimo ba puisano ea likhoebo tse nyane le kutloisiso ea rona ea litebello tsa hauChina Silicone Thermal Insulation Pad le Thermal Adhesive Pad, Ka litekanyetso tse phahameng ka ho fetisisa tsa boleng ba sehlahisoa le tšebeletso, lihlahisoa tsa rona li rometsoe linaheng tse fetang 25 tse kang USA, CANADA, JEREMANE, FRANCE, UAE, Malaysia joalo-joalo.Re thabela haholo ho sebeletsa bareki ba tsoang lefats'eng lohle. !
Litsenyehelo tse tloaelehileng tsa JOJUN6100 | |||
Thepa | Yuniti | Letoto la Lihlahisoa | Mokhoa oa Teko |
JOJUN6100 | |||
Mmala |
| Customized | E bonoang |
Botenya | mm | 0.5-5 | ASTM D374 |
Matla a Khoheli a khethehileng | g/cc | 2.8 | ASTM D792 |
Ho thatafala | Shore oo | 30-70 | ASTM D2240 |
Mocheso oa Kopo | ℃ | -50 - +200 |
|
Sehlopha sa Flammability |
| V0 | UL94 |
Thermal Conductivity | W/mK | 1 | ASTM D5470 |
Ho senyeha ha Voltage | KV/mm | >6 | ASTM D149 |
Ho hanyetsa Molumo | ohm-cm | 10 ^14 | ASTM D257 |
Dielectric Constant | 1MHz | 7 | ASTM D150 |
1. Indasteri ea LED
Thermal conductive gasket e sebelisoa pakeng tsa substrate ea aluminium le teba ea mocheso.
Thermal conductive gasket e sebelisoa pakeng tsa substrate ea aluminium le khetla.
2. Indasteri ea matla
Sebelisa mocheso oa mocheso pakeng tsa MOS tube, transformer (kapa capacitor / PFC inductor) le sink ea mocheso kapa ntlo.
3. Indasteri ea puisano
Thermal conduction le mocheso dissipation pakeng tsa boto e ka sehloohong IC le mocheso tebang kapa khetla.
Ho tsamaisa mocheso le ho qhala mocheso pakeng tsa lebokose le behiloeng DC-DC IC le khetla.
4. Indasteri ea Elektronike ea Likoloi
Li-gaskets tsa thermal conductive li ka sebelisoa lits'ebetsong tsa indasteri ea likoloi tsa elektroniki (joalo ka li-ballast tsa mabone a xenon, li-stereo, lihlahisoa tsa letoto la likoloi, jj.).
5. PDP/LED TV
Ho tsamaisa mocheso pakeng tsa amplifier ea matla IC, IC decoder ea setšoantšo le sink ea mocheso (ntlo).
Kopanya Hlohlelletsa
Extrusion
Thermal Pad Production Line
Sejalo
Sephutheloana
Thepa e Tsoang
Teko ea ho Aroha ha Voltage
Thermal Conductivity Tester
Kneader
Laboratori
Thermal conductive gaskets e sebelisoa ho tlatsa lekhalo la moea pakeng tsa sesebelisoa sa mocheso le setsi sa mocheso kapa setsi sa tšepe.Litšobotsi tsa tsona tsa ho tenyetseha le tse otlolohileng li li nolofalletsa ho koahela libaka tse sa lekaneng haholo.Mocheso o fetisoa ho tloha sesebelisoa sa karohano kapa PCB eohle ho ea ho khetla ea tšepe kapa poleiti ea phallo, e ka ntlafatsang katleho le bophelo ba tšebeletso ea lisebelisoa tsa elektronike tse futhumatsang.Mocheso o tsamaisang mocheso o kentsoe pakeng tsa poleiti e batang ea ho qhala mocheso le chip ea ho futhumatsa ho fetisetsa mocheso o hlahisoang ke chip ho poleiti e batang ea ho qhala mocheso, kahoo e fokotsa mocheso oa chip.Khatello ea khatello e tla etsahala ha mocheso oa conduction pad o hatelloa.Khatello ea khatello e tla eketseha ka keketseho ea palo ea khatello.Ha u khetha mocheso oa mocheso oa mocheso, ela hloko hore khatello ea khatello ea mocheso oa mocheso oa mocheso nakong ea khatello ha ea lokela ho ba kholo ho feta khatello e hlokahalang ea mocheso oa mocheso, ho seng joalo chip e tla senyeha.
1. Sehlopha sa setsebi sa R&D
Ts'ehetso ea tlhahlobo ea kopo e netefatsa hore ha u sa tšoenyeha ka lisebelisoa tse ngata tsa tlhahlobo.
2. Tšebelisano ea thekiso ea lihlahisoa
Lihlahisoa li rekisetsoa linaha tse ngata lefatšeng ka bophara.
3. Taolo ea boleng bo thata
4. Nako ea ho fana ka nako e tsitsitseng le taolo e utloahalang ea nako ea ho fana ka taelo.
Re sehlopha sa litsebi, litho tsa rona li na le phihlelo ea lilemo tse ngata khoebong ea machaba.Re sehlopha sa bacha, se tletseng khothatso le boqapi.Re sehlopha se inehetseng.Re sebelisa lihlahisoa tse tšoanelehang ho khotsofatsa bareki le ho hapa tšepo ea bona.Re sehlopha se nang le litoro.Toro ea rona e tloaelehileng ke ho fa bareki lihlahisoa tse tšepahalang ka ho fetisisa le ho ntlafatsa hammoho.Re tšepe, hlola-tlhōla.
Liphihlelo tse ruileng haholo tsa tsamaiso ea merero le mohlala o le mong ho motho oa tšehetso li etsa bohlokoa bo holimo ba puisano ea likhoebo tse nyane le kutloisiso ea rona e bonolo ea litebello tsa hau bakeng sa Theko e tlase Lms Soft Silicone High Thermal Conductivity Die Cut Customized Pad, boleng bo holimo, lits'ebeletso tse nakong le Aggressive. theko ea thekiso.
Theko e theoleloangChina Silicone Thermal Insulation Pad le Thermal Adhesive Pad, Ka litekanyetso tse phahameng ka ho fetisisa tsa boleng ba sehlahisoa le tšebeletso, lihlahisoa tsa rona li rometsoe linaheng tse fetang 25 tse kang USA, CANADA, JEREMANE, FRANCE, UAE, Malaysia joalo-joalo.Re thabela haholo ho sebeletsa bareki ba tsoang lefats'eng lohle. !
1. Molemo o motle oa ho futhumatsa mocheso: 1-15 W / mK.
2. Boima bo tlaase: Ho thatafala ho tloha ho Shoer00 10 ~ 80.
3. Ho sireletsa motlakase.
4. Ho bonolo ho kopanya.
1. Karolo e 'meli ea li-gap filler, sekhomaretsi sa metsi.
2. Thermal conductivity: 1.2 ~ 4.0 W / mK
3. High voltage insulation, khatello e phahameng, ho hanyetsa mocheso o motle.
4. Kopo ea compression, e ka finyella ts'ebetso e ikemetseng.
1. Karohano e tlaase ea oli (ho ea ho 0).
2. Mofuta oa nako e telele, botšepehi bo botle.
3. Ho hanyetsa boemo ba leholimo bo matla (ho hanyetsa mocheso o phahameng le o tlaase -40 ~ 150 ℃).
4. Ho hanyetsa mongobo, ho hanyetsa ozone, ho hanyetsa botsofali.