Setsebi se bohlale moetsi oa thepa ea mocheso conductive

Lilemo tse 10+ Phihlelo ea Tlhahiso
Laptop Thermal Tharollo

Laptop Thermal Tharollo

Thermal interface, joalo ka pad e futhumatsang, grease e futhumatsang, pente ea mocheso le lintho tse fetohang, li entsoe ka ho khetheha ho nahanoa ka litlhoko tsa laptop.

Laptop Thermal Tharollo

Module oa LCD
Theipi e pholisang
Keyboard
Theipi e pholisang
Sekoahelo se ka morao
Sekepe sa mocheso oa graphite
Mojule oa khamera
Ho oela ha mocheso
Pipe ea mocheso
Thermal pad
Fane
Thermal pad
Phase phetoho lintho tse bonahalang

Sekoahelo
Thermal pad
Theipi ea mocheso
Lintho tse monyang maqhubu
Mainboard
Thermal pad
Betri
Mathata a macha a thepa ea mocheso
Ho hloka botsitso ho tlase
Boima bo tlase
Ho bonolo ho sebetsa
Ho hanyetsa mocheso o tlase
Ho tšepahala ho phahameng

Thermal grease bakeng sa CPU le GPU

Thepa 7W/m·K-- Thermal conductivity 7W/m·K Ho hloka botsitso ho tlase Boima bo tlase Botenya bo tšesaane
Sebopeho Boima bo phahameng ba mocheso Ho tšepahala ho phahameng Sebaka sa ho kopana se metsi Botenya bo tšesaane le khatello e tlase ea ho khomarela

Jojun thermal grease e entsoe ka phofo e boholo ba nano le gel ea silika ea metsi, e nang le botsitso bo botle le ts'ebetso e ntle ea mocheso.E ka rarolla bothata ba tsamaiso ea mocheso oa ho fetisa mocheso pakeng tsa li-interfaces ka mokhoa o phethahetseng.

Laptop Thermal Solution2

Teko ea Nvidia GPU (Seva)
7783/7921-- Japan Shin-etsu 7783/7921
TC5026-- DOW CORNING TC5026
Sephetho sa Tlhahlobo

Ntho ea Teko Thermal conductivity(W/m ·K) Lebelo la Fane(S) Tc(℃) Ia(℃) GPUMatla(W) Rca(℃A)
Shin-etsu 7783 6 85 81 23 150 0.386
Shin-etsu 7921 6 85 79 23 150 0.373
TC-5026 2.9 85 78 23 150 0.367
JOJUN7650 6.5 85 75 23 150 0.347

Mokhoa oa Teko

Sebaka sa teko

GPU Nvdia GeForce GTS 250
Tšebeliso ea matla 150W
Tšebeliso ea GPU tekong ≥97%
Lebelo la fan 80%
Mocheso oa Mosebetsi 23 ℃
Nako ea ho matha 15 mets
Software ea liteko FurMark & ​​MSLKombustor

Thermal pad bakeng sa module ea phepelo ea motlakase, hard state drive, leboea le boroa borokho chipset, le mocheso pipe chip.

Thepa Thermal conductivity 1-15 W Molek'hule e nyane 150PPM Shoer0010~80 Ho kenella ha oli <0.05%
Sebopeho Likhetho tse ngata tsa conductivity tsa mocheso Ho hloka botsitso ho tlase Boima bo tlase Ho kenella ha oli e tlase ho fihlela litlhoko tse phahameng

Thermal pads e sebelisoa haholo indastering ea lilaptop.Hajoale, k'hamphani ea rona e na le linyeoe tsa tšebeliso ea terminal bakeng sa letoto la 6000.Ka tloaelo, conductivity ea mocheso ke 3 ~ 6W/MK, empa laptop ea ho bapala lipapali tsa video e na le tlhokahalo e phahameng ea mocheso oa 10 ~ 15W/MK.Botenya bo tloaelehileng ke 25, 0.75, 1.0, 1.5, 1.75, 2.0, joalo-joalo (Unit: mm).Ha ho bapisoa le lifeme tse ling tsa malapeng le tsa kantle ho naha, k'hamphani ea rona e na le boiphihlelo bo bongata ba kopo le bokhoni ba khokahano bakeng sa laptop, e ka fihlelang litlhoko tsa lebelo la bareki.

Mefuta e fapaneng ea litlolo e ka khotsofatsa litlhoko tse fapaneng.

Laptop Thermal Solution5

Lisebelisoa tsa phetoho ea mohato bakeng sa CPU le GPU

Thepa Thermal conductivity 8W/m·K 0.04-0.06 ℃ cm2 w Sebopeho sa molek'hule sa ketane e telele Ho hanyetsa mocheso o phahameng
Sebopeho Boima bo phahameng ba mocheso Ho hanyetsa mocheso o tlase & phello e ntle ea ho senya mocheso Ha ho phallo ebile ha ho phallo e emeng Ho tšepahala ha mocheso o babatsehang
Laptop Thermal Solution6

Lisebelisoa tsa phetoho ea Phase ke sesebelisoa se secha sa motlakase se ka rarollang tahlehelo ea mafura a laptop ea CPU, Lenovo- Legion serie ea Lenovo e sebelisitsoeng pele.

Nomoro ea mohlala. Mofuta oa mose ho maoatle Mofuta oa mose ho maoatle Mofuta oa mose ho maoatle JOJUN JOJUN JOJUN
CPU Power (Watt) 60 60 60 60 60 60
T CPU(℃) 61.95 62.18 62.64 62.70 62.80 62.84
Tc block(℃) 51.24 51.32 51.76 52.03 51.84 52.03
T hp1 1(℃) 50.21 50.81 51.06 51.03 51.68 51.46
T hp12(℃) 48.76 49.03 49.32 49.71 49.06 49.66
T hp13(℃) 48.06 48.77 47.96 48.65 49.59 48.28
T hp2_1(℃) 50.17 50.36 51.00 50.85 50.40 50.17
T hp2_2(℃) 49.03 48.82 49.22 49.39 48.77 48.35
T hp2_3(℃) 49.14 48.16 49.80 49.44 48.98 49.31
Ta(℃) 24.78 25.28 25.78 25.17 25.80 26.00
T cpu-c block(℃) 10.7 10.9 10.9 10.7 11.0 10.8
R cpu-c block(℃/W) 0.18 0.18 0.18 0.18 0.18 0.18
T hp1 1-hp1_2(℃) 1.5 1.8 1.7 1.3 2.6 1.8
T hp1 1-hp1_3(℃) 2.2 2.0 3.1 2.4 2.1 3.2
T hp2 1-hp2_2(℃) 1.1 1.5 1.8 1.5 1.6 1.8
T hp2 1-hp2_3(℃) 1.0 2.2 1.2 1.4 .4 0.9
R cpu-amb.(℃/W) 0.62 0.61 0.61 0.63 0.62 0.61

Lintho tsa rona tsa phetoho ea karolo ea VS phase ea mofuta oa mose ho maoatle, data e felletseng e batla e lekana.