Thermal ConductiveBeha | |||
Thepa | Yuniti | Letoto la Lihlahisoa | Mokhoa oa Teko |
JOJUN-8350 | |||
Mmala |
| Hlooho | E bonoang |
Botenya | g/cc | 3.1 | ASTM D792 |
Lebelo la Extrusion@30cc, 90psi | g/mets | 10-90 |
|
KopoMocheso | ℃ | -50 ~ +200 |
|
Ho chesaSehlopha |
| V0 | UL94 |
MochesoBoikhantšo | W/mK | 3.5 | ASTM D5470 |
TšenyehoPalo ea li-volts | KV/mm | >5 | ASTM D149 |
BolumoHo hanyetsa | ohm-cm | 10^13 | ASTM D257 |
DielectricKamehla | 1MHz | 7 | ASTM D150 |
Leseli la LED
Thepa ea puisano,
CPU ea mohala oa thekeng,
Module wa memori,
IGBT
Li-module tsa motlakase,
Sebaka sa semiconductor ea matla.
Kopanya Hlohlelletsa
Extrusion
Thermal Pad Production Line
Sejalo
Sephutheloana
Thepa e Tsoang
Teko ea ho Aroha ha Voltage
Thermal Conductivity Tester
Kneader
Laboratori
Mocheso o motle oa mocheso : 9 W / MK
Lintho tse nang le likarolo tse peli, tse bonolo ho li boloka;
Lintho tse babatsehang tse phahameng le tse tlaase tsa mocheso le botsitso ba lik'hemik'hale;
Nako ea ho folisa e ka fetoloa ho latela mocheso.
Thepa e ikemetseng e ka sebelisoa ho lokisa botenya;
E sebelisoa habonolo bakeng sa ts'ebetso ea othomathike ea sistimi ea ho fana.
1. Molemo o motle oa ho futhumatsa mocheso: 1-15 W / mK.
2. Boima bo tlaase: Ho thatafala ho tloha ho Shoer00 10 ~ 80.
3. Ho sireletsa motlakase.
4. Ho bonolo ho kopanya.
1. Karolo e 'meli ea li-gap filler, sekhomaretsi sa metsi.
2. Thermal conductivity: 1.2 ~ 4.0 W / mK
3. High voltage insulation, khatello e phahameng, ho hanyetsa mocheso o motle.
4. Kopo ea compression, e ka finyella ts'ebetso e ikemetseng.
1. Karohano e tlaase ea oli (ho ea ho 0).
2. Mofuta oa nako e telele, botšepehi bo botle.
3. Ho hanyetsa boemo ba leholimo bo matla (ho hanyetsa mocheso o phahameng le o tlaase -40 ~ 150 ℃).
4. Ho hanyetsa mongobo, ho hanyetsa ozone, ho hanyetsa botsofali.